Telecom & Optical Interconnects--MIJOINT

Solution Overview

Overview

5G telecommunications equipment places demanding requirements on the manufacture of high-speed backplane connectors, board-mounted connectors, and cable assemblies, including high-frequency performance, high-density integration, and reliability. These connectors must support high-speed data transmission while meeting strict requirements for pin positioning, terminal coplanarity, solder joint quality, and consistent appearance.

5G High-Speed Backplane Connector Assembly, Testing & Inspection Line
Cycle time: ≤ 2.0 s | Yield: ≥ 99.5%

Needs & Solution

Requirements & Solutions

Industry Needs & Challenges

High-speed backplane connectors feature complex structures and a large number of terminals, making it difficult to maintain consistent assembly quality through manual operations.
Telecommunications equipment requires high signal integrity and connection reliability. Pin insertion, soldering, and dimensional inspection must therefore form a closed-loop quality control process.
High-volume production demands short cycle times, high yields, and fast changeovers.
Frequent changeovers between multiple connector models and specifications result in low equipment reuse when conventional dedicated machines are used.
Inspection and production data need to be integrated to support quality traceability and process optimization.

Mijoint Solution

For 5G telecommunications applications, MIJOINT provides automated production lines for high-speed backplane connectors, covering loading, assembly, testing, inspection, and tray loading. The solution can also be extended to high-speed interconnect products such as NearStack and ExaMAX 2.

Through precision feeding, cam-driven pin insertion, vision guidance, AOI and 3D inspection, electrical performance testing, defective-part rejection, and automated packaging, the line enables continuous-flow production with high consistency.

Process & Capability

Processes & Capabilities

01

5G High-Speed Backplane Connector Production Line

自动送料、自动组装、100% 电气性能测试、AOI 检测。

02

High-Speed Pin Insertion

凸轮机构与双拨送机构支持高速连续插针。

03

Machine Vision Inspection

可用 CCD / 3D 检测针位、GAP、高度和外观缺陷。

04

High-Precision Positioning

ExaMAX2 项目设备重复精度 ±0.01mm，满足数据中心和通信设备连接器需求。

05

Flexible Changeovers

标准化平台和模块化设计支持多规格连接器快速切换。

Customer Verification

Customer Validation

The 5G telecommunications solution is built on proven applications involving high-speed backplane connectors and high-speed interconnect products such as NearStack and ExaMAX 2. Key performance indicators for the 5G high-speed backplane connector production line are provided on the homepage.

The NearStack project supports Cisco’s data center and 5G equipment requirements, while the ExaMAX 2 project addresses high-speed backplane requirements for data centers and telecommunications equipment. Electrical testing, CCD vision inspection, and 3D inspection ensure consistent product quality.

≤ 2.0s CT ≤ 2.0 s Cycle Time of the 5G High-Speed Backplane Connector Assembly, Testing & Inspection Line

≥ 99.5% Yield ≥ 99.5% Yield of the 5G High-Speed Backplane Connector Production Line

±0.01mm ExaMAX 2 Assembly & Inspection System Accuracy

6500W 65 MP ExaMAX 2 Large-Field-of-View Inspection Camera

< 0.6s Cycle Time per Pin < 0.6 s ExaMAX 2 T-TOP Pin Insertion Cycle Time