AI Server--MIJOINT

Solution Overview

Overview

AI servers continue to promote the iteration of high-speed interconnect products such as 56G, 112G, and 224G PAM-4, and the specifications of cables, backplanes, connectors, and near-chip interconnect components are changing rapidly. Traditional customized lines are prone to problems such as repeated investment, long replacement cycles, and low asset utilization during product switching, process upgrades, and production capacity fluctuations.

MIJOINT Intelligence’s business scope has covered AI servers, data centers, 5G communications, consumer electronics, new energy vehicles, industrial automation and other fields. The AI server scenario focuses on the flexible manufacturing capabilities of high-speed cables and high-speed backplane products.

Needs & Solution

Needs and plans

Industry needs and pain points

MIJOINT Solution

MIJOINT takes "standardized platform + modular components" as the core to build a flexible automation platform for AI server high-speed cables and high-speed connectors. The platform can switch between single machine, two machines, three machines or complete line mode, and supports rapid mold change through universal fixtures, standard flow channels, fast interfaces and independent control systems.

The solution can cover wire arrangement, wire processing, UV/CO2 laser stripping, conductor pre- and final shaping, Hot Bar welding, resistance welding, PGRS welding, UV dispensing, Wafer automatic feeding, visual positioning, AOI detection, key parts life control, MES data docking, etc.

Process & Capability

Craftsmanship and capabilities

Customer Verification

Customer verification

MIJOINT takes "standardized platform + modular components" as the core to build a flexible automation platform for AI server high-speed cables and high-speed connectors. The platform can switch between single machine, two machines, three machines or complete line mode, and supports rapid mold change through universal fixtures, standard flow channels, fast interfaces and independent control systems.

The solution can cover wire arrangement, wire processing, UV/CO2 laser stripping, conductor pre- and final shaping, Hot Bar welding, resistance welding, PGRS welding, UV dispensing, Wafer automatic feeding, visual positioning, AOI detection, key parts life control, MES data docking, etc.