Company NearStack 100Ω connector and cable assembly automatic line

With the continuous upgrade of AI servers, data centers and 5G communication equipment, high-speed interconnect products are evolving towards higher bandwidth, lower latency and more compact layout. NearStack 100Ω connectors and cable assemblies are designed for space-constrained Near-ASIC cabling scenarios, which require high-speed signal transmission and stable, reliable precision assembly in limited space. Focusing on Cisco data center/5G equipment needs and Molex NearStack connector manufacturing needs, MIJOINT Intelligence provided complete automation solutions and equipment for the project.

Project background

NearStack 100Ω connectors and cable assemblies are a type of high-speed interconnect products for telecommunications, data centers and high-performance computing equipment. Offering jumper and I/O BiPass connectivity, this component is a compact, low-mating near-ASIC cabling solution that supports high-speed transmission requirements up to 56Gbps PAM-4.

The difficulty in manufacturing this type of product lies not only in the accuracy of a single process, but in the continuous stability from wafer feeding, insertion, wire preprocessing, laser welding to CAN assembly and AOI detection. Any small positional deviation or poor soldering can affect signal integrity and long-term reliability.

Automation solution

MIJOINT intelligently built an automated whole-line solution around NearStack products, covering terminal assembly, welding, CAN assembly and AOI detection. The equipment realizes continuous production from key parts assembly to welding inspection through wafer automatic feeding, automatic grabbing, servo positioning, guide pin positioning and visual guidance welding.

In the wafer insertion component, the device identifies the wafer direction through the laser sensor, and uses the servo motor and screw mechanism to complete grabbing, positioning and insertion. The welding part uses visual guidance and linear motor drive to complete high-precision laser welding, and form a quality closed loop through pre-welding positioning, welding execution and post-welding AOI inspection.

Process Difficulties

The first type of difficulty in the NearStack project is precision insertion. Wafer insertion conductors are not allowed to be bent, and plastic parts are not allowed to be damaged or deformed. The equipment must not only ensure the insertion force and positioning accuracy, but also adapt to the small errors of the parts themselves.

The second type of difficulty is welding quality. High-speed interconnection products have high requirements on the stability of solder joints, and problems such as explosion, leakage, and melt lines should not occur after welding. MIJOINT combines visual positioning, linear motors, high-precision laser welding and life control of key parts to reduce the impact of manual machine adjustments and process fluctuations on welding quality.

Customer Value

This project transforms the critical manufacturing process of NearStack connectors and cable assemblies from a discrete process into a continuous, automated process. For customers, this means more stable assembly accuracy, less manual dependence, clearer process quality control, and a manufacturing method more suitable for large-scale delivery of high-speed interconnect products.